The Leading research firm, Linley Group ranked CEVA (News - Alert) as the worldwide leader in DSP licensing revenue and in licensable DSP unit shipments in the year 2009 with a market share of 78 percent and 80 percent respectively, as published in their recent report, titled ‘Mobile and Wireless Semiconductor Market Share 2009.’
World-leading semiconductors devices are leveraging CEVA’s industry-leading DSP cores to empower a broad range of application such as cellular baseband, HD video, audio and voice-over-IP.
According to Joseph Byrne, an analyst at The Linley Group and author of Mobile and Wireless Semiconductor Market Share 2009, CEVA supplies DSPs to leading developers of consumer electronics and communications chips, and has been by far the most successful supplier of DSP IPs.
In a press release, Joseph said, “The Company’s strong customer base continues to gain significant market share at leading OEMs like Nokia and Samsung (News - Alert), further strengthening their leadership position in the licensable DSP arena. Furthermore, the serviceable market for merchant DSP IP in connected devices, portable and consumer electronics is rapidly expanding and CEVA is well positioned to capitalize on this.”
As the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, CEVA's latest and next generation CEVA-XC321 and CEVA-XC323 DSPs has the capability to overcome stringent power consumption, time-to-market and cost constraints associated with developing high-performance multimode 2G/3G/4G solutions. The Linley Group's Microprocessor Report provides in-depth independent analysis of the CEVA-XC323 DSP.
In a statement, Gideon Wertheizer, CEO of CEVA said, “CEVA is pleased to be ranked by The Linley Group as the worldwide leader in DSP licensing revenue and licensable DSP unit shipments. Our clear leadership illustrates the strength of our DSP portfolio, and our ability to support our customers in the development of highly successful products based on our DSPs.”
CEVA-powered baseband processors are empowering seven out of the world's top eight handset OEMs, with one out of every three handsets leveraging CEVA’s DSP technology. As the handset industry shifts more designs to CEVA-powered wireless semiconductor customers such as Broadcom, Infineon, Samsung, Spreadtrum, ST-Ericsson (News - Alert) and VIA Telecom, CEVA’s market presence is expected to grow exponentially.
Carolyn John is a Contributor to TMCnet. To read more of her articles, please columnist page.
Edited by Jaclyn Allard